DoCoMo to build HSUPA chip

Japanese operator NTT DoCoMo had teamed up with electronics manufacturers Fujitsu and Sharp and semiconductor firm Renesas Technology to co develop and HSUPA platform.

DoCoMo said the SH-Mobile G4 single chip LSI device, will support HSUPA1/HSDPA2/WCDMA and GSM/GPRS/EDGE.

The technology is due for completion by the first quarter of 2010.

The SH-Mobile G4 will be fabricated with 45-nm process technology and its creators say it will offer improved performance for applications handling HD3 video and 3D graphics.

In addition to HSDPA cat.8 for downlink speeds of up to 7.2Mbps, the G4 will support HSUPA to boost uplink speeds to a maximum of 5.7Mbps, DoCoMo said.