Vendors club together for storage shake up
A handful of kit manufacturers got together on Thursday in support of an industry specification for removable memory cards and embedded memory being standardized by the JEDEC Solid State Technology Association, an open standards organisation in the semiconductor industry. Nokia, Samsung Electronics, Sony Ericsson, Micron Technology, Spansion, STMicroelectronics, and Texas Instruments are among the backers [...]
Bluetooth lines up V2.1
The Bluetooth Special Interest Group (SIG), the trade association responsible for advancing Bluetooth wireless technology, announced the adoption of Core Specification Version 2.1+EDR (Enhanced Data Rate) on Monday. Key enhancements in Bluetooth Core Version 2.1 +EDR include improved pairing between devices, security enhancements, support for NFC technology that would allow a user to hold two [...]
Moto beefs up 3G platform
As if in response to analyst criticism of its 3G portfolio, Motorola on Monday announced an expansion of its relationship with Texas Instruments to include 3G, WiMAX and OMAP technologies. Under the deal, Motorola will develop 3G handsets based on processors from TI’s OMAP (Open Multimedia Applications Platform) 3 architecture. But handsets based on this [...]
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