Next gen iPhone to use Infineon HSDPA chipset
09 April 2008
Next gen iPhone to use Infineon HSDPA chipset
One of the many Apple iPhone hackers out there claims to have found more solid evidence that a 3G version of the device is imminent.
Zibri, the hacker behind the ZiPhone application, one of the original jailbreaking and unlocking tools for the iPhone, claims to have made the discovery while trawling through the code for the iPhone beta SDK.
In the code there is a line which makes reference to the Infineon SGOLD3H chipset, otherwise known as the PMB8878. The currently available iPhone uses the SGOLD-28876 as its EDGE-capable baseband processor. The SGOLD3 however is fully HSDPA 7.2Mbps capable, which suggests the next generation iPhone will pack blazing fast connectivity.
Read more on the 3G iPhone speculation.
In related news, iPhone developers working with the latest version of the beta firmware woke up to a pink screen of death on Tuesday.
For reasons that are not yet clear, Apple set the latest firmware to expire on Tuesday, despite the fact it is only 11 days old, leaving all those who had installed it with unusable devices.
Apple has since released beta 3, which should solve the issue, although the company has not yet come forward with an explanation.
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